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COB LED Technology

COB, an acronym for "Chip-On-Board," translates to "chip packaging on the board." This technology directly adheres the bare light-emitting chips to the substrate using conductive or non-conductive adhesive, forming a complete module. This eliminates the need for chip masks used in traditional SMD packaging, thereby removing the physical spacing between chips.

GOB LED Technology

GOB, short for "Glue-On-Board," refers to "gluing on the board." This innovative technology uses a new type of nano-scale filling material with high optical and thermal conductivity. It encapsulates traditional LED display PCB boards and SMD beads through a special process and applies a matte finish. GOB LED displays fill the gaps between beads, akin to adding a protective shield to the LED module, significantly enhancing protection. In summary, GOB technology increases the weight of the display panel while significantly extending its lifespan.

GOB LED Screens Advantages

Enhanced Shock Resistance

GOB technology provides LED displays with superior shock resistance, effectively mitigating damage from harsh external environments and significantly reducing the risk of breakage during installation or transportation.

Crack Resistance

The adhesive's protective properties prevent the display from cracking upon impact, creating an indestructible barrier.

Impact Resistance

The protective adhesive seal of GOB significantly reduces the risk of impact damage during assembly, transportation, or installation.

Dust and Pollution Resistance

The board-gluing technique effectively isolates dust, ensuring the cleanliness and quality of GOB LED displays.

Waterproof Performance

GOB LED displays feature waterproof capabilities, maintaining stability even in rainy or humid conditions.

High Reliability

The design incorporates multiple protective measures to reduce the risk of damage, moisture, or impact, thereby extending the display's lifespan.

COB LED Screens Advantages

Compact Design

Chips are directly bonded, eliminating the need for additional lenses and packaging, significantly reducing size and saving space.

Energy Efficiency

Higher light efficiency than traditional LEDs results in superior illumination.

Improved Illumination

Offers more uniform illumination compared to traditional models.

Optimized Heat Dissipation

Reduced heat generation from chips eliminates the need for additional cooling measures.

Simplified Circuitry

Requires only one circuit, resulting in a more streamlined design.

Low Failure Rate

Fewer solder joints decrease the risk of failure.

Differences Between COB and GOB Technologies

The manufacturing process of COB LED displays involves directly attaching the 'light-emitting chips' to the PCB substrate, followed by coating them with a layer of epoxy resin to complete the packaging. This method primarily aims to protect the 'light-emitting chips.' In contrast, GOB LED displays form a protective layer by applying a transparent adhesive to the surface of the LED beads, with the primary focus on protecting the 'LED beads.'

COB technology focuses on protecting LED chips, while GOB technology provides additional protection for LED beads. Implementing GOB technology requires strict adherence to the specific requirements of LED display products, involving complex production processes, high-standard automated production equipment, and specialized materials for GOB LED displays. Customized molds are also necessary. After product assembly, GOB packaging requires a 72-hour aging test to inspect the beads before gluing, followed by another 24-hour aging test after gluing to ensure product quality. Therefore, GOB LED displays have extremely strict controls over material selection and process management.

Applications

COB LED displays, by eliminating the physical spacing between LED beads, can achieve ultra-narrow pitch displays with pitches below 1mm, making them primarily used in the small-pitch display field. In contrast, GOB LED displays comprehensively enhance the protective performance of traditional LED displays, effectively resisting interference from harsh environments with multiple protective functions, including waterproofing, moisture-proofing, impact-proofing, dust-proofing, corrosion-proofing, blue light-proofing, and static electricity-proofing. This expands the application scope of LED displays.

Post time: Aug-17-2024

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COB vs GOB: Differentiation of LED display packaging technology