Iindaba

I-COB LED Technology

I-COB, isifinyezo se-"Chip-On-Board," iguqulela "i-chip packaging ebhodini." Le teknoloji ibambelela ngokuthe ngqo kwii-chips ezingenanto ezikhupha ukukhanya kwi-substrate usebenzisa i-conductive okanye i-non-conductive adhesive, eyenza imodyuli epheleleyo. Oku kuphelisa imfuno yeemaski zechip ezisetyenziswa kwipakethe yemveli ye-SMD, ngaloo ndlela isusa isithuba phakathi kweetshiphusi.

I-GOB LED Technology

I-GOB, imfutshane ye-"Glue-On-Board," ibhekisela "kwi-gluing ebhodini." Le teknoloji entsha isebenzisa uhlobo olutsha lwezinto zokuzalisa i-nano-scale kunye ne-optical ephezulu kunye ne-thermal conductivity. Ifaka iibhodi zePCB zokubonisa i-LED kunye namaso e-SMD ngenkqubo ekhethekileyo kwaye isebenzise ukugqitywa kwe-matte. Iziboniso ze-GOB ze-LED zigcwalisa izikhewu phakathi kobuhlalu, ngokufana nokongeza ikhuselo elikhuselayo kwimodyuli ye-LED, ukuqinisa kakhulu ukhuseleko. Ngamafutshane, itekhnoloji ye-GOB yonyusa ubunzima bephaneli yokubonisa ngelixa ibalula kakhulu ubomi bayo.

Izikrini ze-GOB ze-LEDIingenelo

Ukomelezwa koKuxhathisa ukothuka

Itekhnoloji ye-GOB ibonelela ngeziboniso ze-LED ngokuxhathisa ukothuka okuphezulu, ukunciphisa ngokufanelekileyo umonakalo ovela kwiindawo ezirhabaxa zangaphandle kunye nokunciphisa kakhulu umngcipheko wokuqhekeka ngexesha lofakelo okanye ukuthutha.

I-Crack Resistance

Iimpawu ezikhuselayo ze-adhesive zithintela umboniso ekuqhekekeni kwimpembelelo, ukudala umqobo ongapheliyo.

Ukuchasa impembelelo

Isitywina esinamathelisa esikhuselayo seGOB sinciphisa kakhulu umngcipheko womonakalo wempembelelo ngexesha lokuhlanganisa, ukuthutha, okanye ukufakela.

Ukuxhathisa uthuli kunye noNgcoliseko

I-board-gluing technique ihlukanisa ngokufanelekileyo uthuli, iqinisekisa ukucoceka kunye nomgangatho we-GOB LED displays.

Ukusebenza kokungangeni manzi

Iziboniso ze-GOB ze-LED zibonisa amandla angangeni manzi, ukugcina uzinzo nakwiimeko zemvula okanye ezifumileyo.

Ukuthembeka okuphezulu

Uyilo lubandakanya iindlela ezininzi zokukhusela ukunciphisa umngcipheko womonakalo, ukufuma, okanye impembelelo, ngokwandisa ubomi bomboniso.

Izikrini ze-COB ze-LEDIingenelo

Uyilo olubambeneyo

Ii-chips ziboshwe ngokuthe ngqo, zisusa imfuno yeelensi ezongezelelweyo kunye nokupakishwa, ukunciphisa kakhulu ubungakanani kunye nokugcina indawo.

Ukusebenza kakuhle kwamandla

Ukusebenza kokukhanya okuphezulu kunee-LED zendabuko kubangela ukukhanya okuphezulu.

UkuKhanya okuphuculweyo

Inikezela ngokukhanya okufanayo ngakumbi xa kuthelekiswa neemodeli zemveli.

Ukusasazwa koBubushushu obulungiselelweyo

Ukuveliswa kobushushu obuncitshisiweyo kwiitshiphusi kuphelisa imfuneko yamanyathelo okupholisa okongeziweyo.

Isekethe eyenziwe lula

Ifuna isekethe enye kuphela, ekhokelela kuyilo olulungelelanisiweyo.

Inqanaba lokusilela okuphantsi

Amalungu ambalwa e-solder anciphisa umngcipheko wokungaphumeleli.

Umahluko phakathi kweCOB kunye neGOB Technologies

Inkqubo yokwenziwa kwemiboniso ye-COB ye-LED ibandakanya ngokuthe ngqo ukuncamathisela 'iitshiphusi ezikhupha ukukhanya' kwi-PCB substrate, ilandelwe ngokuyigquma ngomaleko we-epoxy resin ukugqiba ukupakishwa. Le ndlela ijolise ikakhulu ekukhuseleni 'iitshiphu ezikhupha ukukhanya.' Ngokwahlukileyo, iziboniso ze-GOB ze-LED zenza umaleko okhuselayo ngokufaka i-adhesive transparent ebusweni bamaso e-LED, ngokugxila okuphambili ekukhuseleni 'i-LED beads.'

Itekhnoloji ye-COB igxile ekukhuseleni iitshiphusi ze-LED, ngelixa itekhnoloji ye-GOB ibonelela ngokhuseleko olongezelelweyo lwe-LED ubuhlalu. Ukuphumeza iteknoloji ye-GOB kufuna ukuthotyelwa ngokungqongqo kwiimfuno ezithile zeemveliso zokubonisa i-LED, ezibandakanya iinkqubo zokuvelisa eziyinkimbinkimbi, izixhobo zokuvelisa ezizenzekelayo ezisemgangathweni, kunye nezinto ezikhethekileyo kwi-GOB LED displays. Iimolds ezenziwe ngokwezifiso nazo ziyimfuneko. Emva kwendibano yemveliso, ukupakishwa kwe-GOB kufuna uvavanyo lokuguga lweeyure ezingama-72 ukuhlola ubuhlalu ngaphambi kokuncamathisela, kulandele olunye uvavanyo lokuguga lweeyure ezingama-24 emva kokuncamathelisa ukuqinisekisa umgangatho wemveliso. Ke ngoko, iziboniso ze-GOB ze-LED zinolawulo olungqongqo kakhulu ekukhetheni izinto kunye nolawulo lwenkqubo.

Usetyenziso

Iziboniso ze-COB ze-LED, ngokususa isithuba somzimba phakathi kwee-LED ze-LED, zinokufikelela kwi-ultra-narrow pitch displays kunye ne-pitches engaphantsi kwe-1mm, ezenza ukuba zisetyenziswe ngokukodwa kwibala lokubonisa i-pitch encinci. Ngokwahlukileyo, i-GOB ye-LED ibonisa ngokubanzi ukunyusa ukusebenza kokukhusela kweziboniso ze-LED zendabuko, ukuxhathisa ngokufanelekileyo ukuphazamiseka kwiindawo ezibuhlungu kunye nemisebenzi emininzi yokukhusela, kubandakanywa ukungangeni kwamanzi, ukufudumala kwamanzi, ukutshatyalaliswa kwempembelelo, uthuli-uthuli, i-corrosion-proofing, ukukhanya okuluhlaza okwesibhakabhaka. , kunye ne-static-proofing yombane. Oku kwandisa umda wosetyenziso lweziboniso ze-LED.

Ixesha lokuposa: Aug-17-2024

Idilesi yendawo yokugcina impahla: 611 REYES DR, WALNUT CA 91789

COB vs GOB: Umahluko we-LED yokupakisha iteknoloji yokupakisha